Diamond Lapping Compound Paste
"N.S. Industries" diamond lapping compounds are manufactured using metal as well
as resinbond diamond powders and state of the art carriers for different lapping
applications. In applications where strong cutting action is required the blocky
metal bond diamonds are used which retain their shape and cutting edges for long
period of time giving efficient cutting action where as for faster cutting irregularly
shaped friable resin bond diamonds are preferred.
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DIAMOND LAPPING COMPOUNDS FIELDS OF APPLICATION
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MICRON
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CODE NO.
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D - 1
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D - 2
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FINE POLISH
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D - 3
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D - 6
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D - 7
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D - 10
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MEDIUM CUTTING
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D - 15
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D - 30
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D - 40
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ROUGH CUTTING
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D - 50
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D - 60
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D - 80
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NOTE: Diamond compound is
available in standard & high concentration in 5 GMS & 15 GMS. syringe packing
in Oil soluble.
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